Book description
Finding new materials for copper/low-k interconnects is critical to the
continuing development of computer chips. While copper/low-k
interconnects have served well, allowing for the creation of Ultra Large
Scale Integration (ULSI) devices which combine over a billion
transistors onto a single chip, the increased resistance and RC-delay at
the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the
materials and methods which might be suitable replacements. It covers
a broad range of topics, from physical principles to design,
fabrication, characterization, and application of new materials for
nano-interconnects, and discusses:
- Interconnect functions, characterisations, electrical properties
and wiring requirements
- Low-k materials: fundamentals, advances and mechanical properties
- Conductive layers and barriers
- Integration and reliability including mechanical reliability,
electromigration and electrical breakdown
- New approaches including 3D, optical, wireless interchip, and
carbon-based interconnects
Intended for postgraduate students and researchers, in academia and
industry, this book provides a critical overview of the enabling
technology at the heart of the future development of computer chips.
