Book description
Since the first light-emitting diode (LED) was invented by Holonyak and
Bevacqua in 1962, LEDs have made remarkable progress in the past few
decades with the rapid development of epitaxy growth, chip design and
manufacture, packaging structure, processes, and packaging materials.
LEDs have superior characteristics such as high efficiency, small size,
long life, low power consumption, and high reliability. The market for
white LED is growing rapidly in various applications. It has been widely
accepted that white LEDs will be the fourth illumination source to
substitute the incandescent, fluorescent, and high-pressure sodium
lamps. With the development of LED chip and packaging technologies, the
efficiency of high power white LED will broaden the application markets
of LEDs while changing the lighting concepts of our lives.
In LED Packaging for Lighting Applications, Professors Liu and
Luo cover the full spectrum of design, manufacturing, and testing.
Many concepts are proposed for the first time, and readers will
benefit from the concurrent engineering and co-design approaches to
advanced engineering design of LED products.
- One of the only books to cover LEDs from package design to
manufacturing to testing
- Focuses on the design of LED packaging and its applications such
as road lights
- Includes design methods and experiences necessary for LED
engineers, especially optical and thermal design
- Introduces novel LED packaging structures and manufacturing
processes, such as ASLP
- Covers reliability considerations, the most challenging problem
for the LED industry
- Provides measurement and testing standards, which are critical
for LED development, for both LED and LED fixtures
- Codes and demonstrations available from the book's Companion Website
This book is ideal for practicing engineers working in design or
packaging at LED companies and graduate students preparing for work in
industry. This book also provides a helpful introduction for advanced
undergraduates, graduates, researchers, lighting designers, and
product managers interested in the fundamentals of LED design and production.
Color version of selected figures can be found at www. wiley.
com/go/liu/led
Sheng Liu is a ChangJiang Professor of Mechanical
Engineering at Huazhong University of Science and Technology. He holds
a dual appointment at Wuhan National Laboratory for Optoelectronics,
and has served as tenured faculty at Wayne State University. He has
over 14 years experience in LED/MEMS/IC packaging and extensive
experience in consulting with many leading multi-national and Chinese
companies. Liu was awarded the White House/NSF Presidential Faculty
Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC
Overseas Young Scientist in 1999. He has been an associate editor for
IEEE Trans. On Electronic Packaging Manufacturing since 1999 and an
associate editor of Journal of Frontiers of Optoelectronics in China
since 2007. He is currently one of the 11 National Committee Members
in LED under Ministry of Science and Technology. He obtained a Ph. D.
from Stanford in 1992, and got MS and BS in flight vehicle design,
Nanjing University of Aeronautics and Astronautics, and he had three
years industrial experience in China and USA. He has filed more than
70 patents in China and the USA, and has published more than 300
technical articles.
Xiaobing Luo is a professor at Huazhong University of Science
and Technology, Wuhan, China, with appointments at the School of
Energy and Power Engineering and Wuhan National Lab for
Optoelectronics. He received his Ph. D. in 2002 from Tsinghua
University, China. He has also worked in Samsung Electronics in Korea
as a Senior Engineer. His main research interests are LED, heat and
mass transfer, microfluidics, MEMS, and sensors and actuators. He has
published more than 60 papers and has applied for 40 patents in the
USA, Korea, Japan, Europe and China.
